|
EMC/ESD Technical service-1
Service Items for SiP and Testing Circuits (IC & PCB ,Device )
- Development on simulation, measurement, and testing analysis technologies of system in package design.
- Development on advanced system in package solution.
- Design/Research Topics in SiP --PI/SI/EMI Study & test service.
- EMI/EMS/ESD Far-Field/Near-Field Mea/Sim for SiP and device testing service.
- Conventional Chip Probing technical improvement study & testing service .(On Wafer Testing).
- 3D Direct Contact Measurement technical study & tester design service.
- Non-contact EMI/EMS/ESD Measurement Technologies study & test service.
- Decoupling research for IC package and lead frame.
- Direct contact probe design service and consulting.
- DUT EMI noise study and testing service.
- Component qualification and noise budget analysis service.
- LCD panel noise distribution analysis and testing service.
- IC , Module noise distribution analysis and testing service.
- System De-Sense issue analysis and study service . ( 100kHz to 44GHz)
- EMI Shielding effectiveness analysis and test service for IC package material.
EMC/ESD Technical service-2
IC , Module noise distribution analysis
DUT: RF Module
EMC/ESD Technical service-3
EMI Shielding effectiveness analysis and test service for IC package material.
DUT: IC package material
 |
 |
 |
Shielding Effectiveness Result
|
DUT: SSD controller IC.
Near Field testing Concept
Components/ PCB module/ IC Application Note
PCB Area Scan
 |
 |
 |
|
|
EMC/ESD Technical service-4
ESD Diagnosis and energy trace analysis 靜電能量路徑分析
Noise Finding & Debug Service 雜訊分析與工程整改
|
Strong technical Support for Noise Analysis & Debug service :
Best teams for Testing & debug engineering Service.
Support to quick get solution & pass certificated.
Support to device into mass production ( Time to Market)
Support to IQC & IPQC & QA system ( Inspection service )
Components qualification & Material analysis service.
|
|
 |
Welcome contact us for more detail information.
歡迎與我們聯係取得更詳細的客製化說明！
|
